Stress Analysis and Strength Design of Adhesive Bonded Joints

Reliability analysis of bonded joints with variations in adhesive thickness

The Fuzzy Finite Element Stress Analysis of Adhesive-Bonded Single Lap Joints

An adhesive-bonded single lap joint is analyzed using a new fuzzy finite element model. In the model, Young’s moduli and Poisson’s ratios of the joint materials are taken as fuzzy numbers in order to take the uncertainty of the material properties into account. The fuzzy numbers are modeled using linear triangular membership functions. At a selected material point in the adhesive layer, the pos...

Thermal Stress in Bonded Joints

This paper considers the stress distributions in bonded materials induced by differential expansion or contraction of these materials. The analytical approach is similar to the lap joint theories attributed to Volkersen and expanded by Goland and Reissner. Several simple and typical analytical models are presented to bring out the relative importance of dlrerent geometrical and material paramet...

Thermal Residual Stress Analysis of Epoxy Bimaterial Laminates and Bonded Joints

Finite element analysis (FEA) and continuum mechanics techniques have been used to model the thermal residual stress distribution in bonded joints and assess the suitability of using two-dimensional (2D) analysis methods. The methods are first employed to investigate stresses in metal-epoxy bi-material strip samples. The change in curvature of two bi-material strip systems during heating and co...

The influence of adhesive constitutive parameters in cohesive zone finite element models of adhesively bonded joints

0020-7683/$ see front matter 2008 Elsevier Ltd. A doi:10.1016/j.ijsolstr.2008.11.016 Abbreviations: ASTM, ASTM International; CC, co continuous cohesive zone method; CPE4I, bilinear inc elements; DACE, design and analysis of computer cantilever beam; DCZM, discrete cohesive zone metho finite element; LEFM, linear elastic fracture mech sampling; SLJ, single lap joint; TTL, trapezoidal tractio * ...